FLAGCHIP Partners File Patent for Innovative Immersion Cooling Concept!
FLAGCHIP is proud to announce that its project partner Kempten University of Applied Sciences have successfully filed a patent for a novel cooling concept developed for the FLAGCHIP power module — marking a significant innovation milestone for the project.
The newly developed solution is based on an advanced immersion cooling approach using a dielectric coolant. By directly addressing the thermal management challenges of high-performance power electronics, the concept significantly enhances module efficiency and reliability. The design reduces the thermal resistance from junction to fluid of the SiC MOSFETs by 50% compared to commercial cooling methods, enabling improved heat dissipation and higher electrical performance.
Thermal test vehicle used to test the patented cooling strategy
Beyond performance gains, the innovation also delivers strong economic benefits. The proposed cooling architecture has the potential to reduce overall power module costs by up to 30%, reinforcing the project’s ambition to combine technological excellence with industrial feasibility.
Thermal management is a critical enabler for next-generation wide bandgap semiconductor devices. By improving heat extraction and system integration, this patented concept directly supports FLAGCHIP’s mission to develop highly efficient, reliable and cost-effective power electronics solutions for future energy systems and hybrid grids.
This achievement highlights FLAGCHIP’s commitment not only to advancing scientific knowledge but also to generating tangible, exploitable results that strengthen Europe’s leadership in power electronics and contribute to the transition toward a more resilient and sustainable energy infrastructure.
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