Key Results

Medium Voltage SiC MOSFET Chipset for 3.3kV and 6.5kV

Novel packages with integrated cooling as well as sensors for condition and health monitoring

TCAD and behavioural models for wide band gap and ultra-wide band gap devices to predict reliability

Estimation of the junction temperature based on Temperature Sensitive Electrical Parameters and on Fiber Bragg Grating

Strategies and methodology for precise and timely enabling of the limp mode

A model to predict the remaining useful life of the power module

A digital twin of the power module for non-conventional condition and health monitoring

Technoeconomic cost models for offshore wind farm maintenance

FLAGCHIP Power Module

Research data and scientific publications

Lessons learnt and guidelines