FLAGCHIP research receives Best Paper Award at THERMINIC 2026
FLAGCHIP was proudly represented at THERMINIC 2026, where our project partner Johann Renner from Kempten University of Applied Sciences presented recent research on an innovative immersion cooling approach for power semiconductors — and received the Best Paper Award for the work “CuBrick: A Novel Vertical Dielectric Immersion Cooling Approach for Power Semiconductors.”
THERMINIC 2026 brought together the international thermal management community in Berlin for three days dedicated to the latest research and technological developments in the field. This year’s edition was the largest THERMINIC to date, welcoming almost 160 delegates from 29 countries at the NYX Hotel Berlin-Koepenick.
The event provided a strong meeting point between research and industry, with 53% of participants representing universities and research institutions and 47% coming from industry, alongside a record 14 exhibitors and supporters.
The awarded FLAGCHIP paper presented CuBrick, a novel dielectric immersion cooling concept designed to address one of the key challenges of high-performance power electronics: efficiently removing heat from increasingly compact and powerful semiconductor devices.
The approach uses specially designed perforated copper blocks (“CuBricks”) that simultaneously act as heat exchangers and electrical interconnects. Integrated into the circuit carrier, the CuBricks enable the dielectric coolant to flow vertically through the power module and directly cool the semiconductor devices. This architecture can shorten the thermal path between the semiconductor and the coolant, enable single- or double-sided cooling, and eliminate some of the conventional insulation and substrate layers typically used in power modules.
The study experimentally investigated different CuBrick configurations and validated the results through numerical simulations. The concept was also benchmarked against other dielectric immersion cooling approaches and a conventional automotive power module using water-glycol cooling. The results demonstrate the strong potential of CuBrick as an alternative thermal management solution for high-power-density power electronics.
Receiving the Best Paper Award at THERMINIC 2026 is an important recognition of the scientific and technological relevance of this work and of FLAGCHIP’s efforts to advance innovative thermal management and packaging solutions for next-generation power electronics.
Congratulations to our partner and the entire team behind this achievement!
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