FlagChip

FlagChip — Transistor Health Estimation

Click a parameter to highlight it on the circuit symbol and in the physical section

Digital Twin · degradation
5 parameters the optimizer infers in real time
Measured inputs
Bench signals that feed the Digital Twin
Outputs · health indicators
What the model computes and exposes
Fixed base parameters
Calibrated offline once. The Digital Twin leaves them fixed online

Circuit Symbol

D G S B VGS VDS IDS I_GSS Ron = Rser₀·(1+ΔRon) Vth = Vth₀ + ΔVth threshold shift Tj Tj = Tamb + Pdiss · Zth 🌡 Zth = ΔTj / Pdiss Rth_total [°C/W] Ron↑ ΔRon = dRon · Rser₀ mobility/channel degradation ΔVth: trapped charges in the gate oxide I_leak extra Ileak: punctured oxide G→S leakage via defects (✕) heat ↓ k_die — chip→DBC solder fatigue Rth_die_eff = k_die · R_die₀ → see physical section heat ↓↓ k_tim — TIM/paste delamination DBC→Base Rth_tim_eff = k_tim · R_tim₀ → see physical section T_amb → model input KP = μn · Cox · W/L IDS ∝ KP·(VGS−Vth)² IDS · (1 + λ·VDS) channel-length modulation IGSS₀ at 25°C, no degr. ref. para detectar Ileak extra

Physical Section + Thermal Layers

P Substrate (Body) — B SiO₂ Oxide N⁺ Source N⁺ Drain Gate — G Die Attach / Solder (chip→DBC) DBC — Direct Bonded Copper TIM / Thermal Paste (DBC→Baseplate) Baseplate ↓ Heatsink → T_amb R_die R_dbc R_tim R_base S D G B VGS VDS IDS (S→D) I_GSS Gate → oxide → Source Ron = Rser₀·(1 + ΔRon) Vth = Vth₀ + ΔVth Tj (°C) Tj = Tamb + Pdiss·Zth Fallo si Tj > Tj_max ⚡ P = VDS·IDS Zth = ΣRth layers Degraded channel — Ron↑ ΔRon = dRon · Rser₀ ΔVth: charges in oxide I_leak extra punctured oxide (✕) k_die · Die-Attach layer solder fatigue → R_die↑ → Tj↑ k_tim · TIM/paste layer delamination → R_tim↑ → Tj↑ T_amb (entrada medida) Tj = Tamb + Pdiss·Zth IDS ∝ KP·(VGS−Vth)² KP = μn · Cox · W/L IDS·(1+λ·VDS) in saturation λ: VDS modulates IDS IGSS₀ at 25°C baseline = no degradation

← Selecciona un parámetro

Los parámetros están clasificados por su papel en el flujo Gemelo Digital de estimación de salud: qué estima el optimizador en tiempo real, qué se mide en banco, qué calcula el modelo como salida, y qué es fijo de calibración offline.